Inductively Coupled Plasma Reactive Ion Etch (II)
Introduction
An inductively coupled plasma (ICP) reactive ion etch enables anisotropic etching, passivation and isotropic etching processes. Suspension structures can be formed by a fabrication process, dry SCREAM. The success of this fabrication process has been found by demonstrating a variety of movable actuators.
Technology
Bi-level micro actuator
Micro-capacitance
- Dry SCREAM Suspension silicon process
- Nano scale high aspect ratio etching process
- Compatible with semiconductor process
Specification
- Dry SCREAM process:
The thickness of structure ~ 30 µm - Nano scale high aspect ratio etching process:
The linewidth of structures < 100 nm
Aspect ratio > 10
Application
- Dry SCREAM process:
Micro-actuator, Suspension structures - Nano scale high aspect ratio etching process:
NEMS, Nano-Optical, Nano-Bio and etc.
 300 nm diameter hole array |
 56 nm diameter pillar array |
 Nano scale trench structure |
