Excimer Laser Micromachining Technology
Introduction
An excimer laser micromachining utilizes a pulse laser operating in the ultraviolet band to ionize and decompose polymer materials. Almost all the organic polymer materials characterize a moderate or intense absorption of the excimer laser. This laser manufacturing machine in ITRC is a projection processing system, which projects the pattern from the mask onto the work piece, either polymer material or metal thin film, with a projection lens of 4× or 10×.
Technology
- Micro lens array machining
- Metal thin film patterning
- Microstructure and curved surface
Specification
- Laser wavelength: 248 nm
Max. pulse energy: 700 mJ
Max. average power: 65 W
Max. repetition rate: 100 Hz - Travel range X-Y axis: 200 mm × 200 mm, Z axis: 5 mm
- Projection System—Mask: 4", beam size on mask: 10 mm × 10 mm
Projection lens: 4×, 10×
Application
- Microstructure and special curved surface microstructure
- Micro-lens array, cylindrical lens and conductive glass processing etc.
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| Conductive glass processing | 2D microstructure array machining |
