Oxide Etching Technology

Oxide etching mechine: Plasmalab System100 ICP380

Purpose

Based on the fabrication technologies of nano/micro structures for silicon material, the dry-etching technologies for silica material is developed. Those technologies can offer internal researcher a high quality fabrication process for advanced studies.

Specifications & Features

It can fabricate nano/micro optical element with side-wall perpendicularity less than ± 5° and bottom roughness of 100 Å.

Quartz substrate etching
Silica film etching
High aspect ratio anisotropic silica etching

Applications

Micro-optical elements
Micro-grating
Bio-chips
Optical elements for high power laser
Nano-structure fabrication
Diffraction optical element

ICP deep oxide etching

Contact

Chien-Hung Ho
E-mail: herch@itrc.org.tw